
Korea Circuit is a specialized company in printed circuit boards (PCB) and has built a business portfolio centered around high value-added products such as high-density interconnects (HDI), semiconductor package substrates, and PCBs for communication and automotive use. Even in the rapidly changing global technology environment, Korea Circuit is recognized for its technology and quality by major clients at home and abroad by stably supplying key components for next-generation IT and automotive industries. The main product groups are as follows.

HDI
Mobile (Smart Phone / Tablet)
Miniaturized, slim high-density, high-quality Build-Up PCBs aligning with the trend of high functionality in mobile devices
Memory Module (DIMM / SODIMM)
Customer customized high-quality PCBs used as main memory in PCs
SSD
High-density, high-quality PCBs used in eco-friendly and next-generation storage devices
Display (LCD / OLED)
Customized high-density, high-quality PCBs meeting customer requirements for high resolution, thin thickness, and light weight

Package Substrate
FCBGA
Package Substrate of large body size and high-density technology applied to servers, AI products, etc.
PBGA
SMD Package Substrate with solar balls arranged in a row applied to game console products
CSP (CSP / UT-CSP / FCCSP)
- CSP: High wiring density Package Substrate applied to PCs, mobile device products, etc.
- UT-CSP: Even thinner ultra-small Package Substrate among CSPs
- FCCSP: Ultra-small, high-performance CSP without wire bonding
Sip
Package Substrate for a standalone system with independent functions through multiple chips in one package

Rigid-Flex
Smart Device (Wearable Device / Display)
High-density, high-quality Rigid-Flexible PCBs suitable for the latest smart devices
Storage (SSD)
High-layer, high-reliability Rigid-Flexible PCBs applicable for high-capacity, high-speed SSDs